ICSCRM2019 | International Conference on Silicon Carbide and Related Materials / September 29 - October 4, 2019 / Kyoto, Japan


The proceedings of ICSCRM2019 will be published in the peer-reviewed conference series Material Science Forum published by Trans Tech Publications Ltd (TTP).

[NEW] The submission deadline for the proceedings has been extended to September 27.
No further extension will be considered.

Manuscript Preparation

Manuscripts have to be prepared; camera ready with 6 pages or more (minimum 6 pages, no upper page limit), for both contributed and invited papers. The content of manuscript must be based on the presentation at the conference. The manuscript template (Word and LaTeX) and the copyright agreement form are available here or in the TTP manuscript submission system.

Please provide keywords. Do not use PACS numbers or general keywords such as “silicon carbide” or “gallium nitride”. Keywords are used to prepare the index.

Manuscript Submission

The authors of accepted ICSCRM 2019 abstracts will receive an email from TTP with unique user ID and password needed to log in to the TTP manuscript submission system. This system will be used to process your manuscript electronically from initial submission through editorial peer review and revisions to final publication in the printed and electronic versions of the ICSCRM 2019 proceedings.

The deadline for submission of all manuscripts (including invited and late news manuscripts) is September 20 September 27 , 2019.

How to submit your manuscripts