Sponsorship Opportunities

A series of International Conference on Silicon Carbide and Related Materials (ICSCRM) started in Washington D.C. in 1987. This ICSCRM2019 is the 18th conference of the ICSCRM series and the fifth ICSCRM held in Japan. The past ICSCRM series have been successfully held, owing to a great deal of financial support from the industry having activities in this technical field. The conference organizers would like to thank them for the past support, and also ask continuous one for this ICSCRM2019.

For the ICSCRM2019, we reform the supporting style to “Sponsorship packages & Other sponsorship opportunities”, so that each supporting company's commitment to the wide bandgap material and power electronics community will become more visible, which indicates each supporting company is well involved in holding ICSCRM2019. We would much appreciate your kind cooperation.

First stage : 30 June, 2019

Final stage : 16 August, 2019

For application and further details, please contact: sp-application@icscrm2019.org

Sponsorship Package

	Category
	Diamond	Platinum	Gold
	JPY 1,000,000	JPY 500,000	JPY 300,000
Advertisement in the program book	1 page color	1 page color	1/2 page gray scale
Logo exposure in the program book	Large size	Middle size	Small size
Logo exposure of conference web site with hyperlinking to sponsor website	Large size	Middle size	Small size
Priority allocation of exhibition space*	First	Second	Third
Logo exposure in front of presentation rooms	Large size	Middle size	Small size
Logo exposure in the conference registration area	Large size	Middle size	Small size
Application to additonal oppotunities for sponsorship package (before June 30, 2019)	Yes	Yes	Yes

*Because the application for exhibition booth has reached the limit, this priority is given only to the sponsors applied before 01 June, 2019.

Additional Opportunities for Sponsorship Package

	Items	Benefit	Price	Availability
A1	Conference Bags	Company logo printed on tab of bags provided to each participant	JPY 1,000,000	0 of 1
A2	Notepads	Company name printed on notepads provided to each participant	JPY 250,000	0 of 1
A3	USB memory devices with abstracts	Company logo printed on USB memory devices provided to each participant	JPY 500,000	0 of 1
A4	Name badges and lanyards	Company logo printed on lanyards provided to each participant	JPY 250,000	0 of 1
A5	Pens	Company name printed on pens provided to each participant	JPY 250,000	0 of 1
A6	6 days Free Pass for Kyoto City Subway	Company logos printed on pass provided to each participant	JPY 250,000	0 of 4
A7	Sake Masu Cups made by wood for Banquet opening event	Company logo printed at side of cups provided to each Banquet attendees	JPY 250,000	0 of 1

note : Only sponsors applying to sponsorship package can apply additional oppotunities for sponsorship package.

Other Sponsorship Opportunities

	Items	Benefit	Price	Maximum number of application
O1	Industrial session support	Company logos displayed in the catering area during the session	JPY 150,000	no limitation
O2	Support of desserts at each conference lunch (all day)	Company logos displayed in the desserts area during each conference lunch	JPY 150,000	no limitation
O3	Confectionery for each coffee break (all day)	Company logos displayed in confectionery area during each coffee break	JPY 150,000	no limitation
O4	Banquet support	Company logos displayed at the Banquet site	JPY 150,000	no limitation

note : Other sponsorship oppotunities can be applied regardless of sponsorship package application.

Notification for additional oppotunities and Other sponsorship : All items from A1 to A7 and from O1 to O4 are limited to two items per sponsor.