ICSCRM2019 | International Conference on Silicon Carbide and Related Materials / September 29 - October 4, 2019 / Kyoto, Japan

Sponsorship Opportunities

A series of International Conference on Silicon Carbide and Related Materials (ICSCRM) started in Washington D.C. in 1987. This ICSCRM2019 is the 18th conference of the ICSCRM series and the fifth ICSCRM held in Japan. The past ICSCRM series have been successfully held, owing to a great deal of financial support from the industry having activities in this technical field. The conference organizers would like to thank them for the past support, and also ask continuous one for this ICSCRM2019.

For the ICSCRM2019, we reform the supporting style to “Sponsorship packages & Other sponsorship opportunities”, so that each supporting company's commitment to the wide bandgap material and power electronics community will become more visible, which indicates each supporting company is well involved in holding ICSCRM2019. We would much appreciate your kind cooperation.

For application and further details, please contact: sp-application@icscrm2019.org

Sponsorship Package

Category
Diamond Platinum Gold
JPY 1,000,000 JPY 500,000 JPY 300,000
Advertisement in the program book 1 page color 1 page color 1/2 page gray scale
Logo exposure in the program book Large size Middle size Small size
Logo exposure of conference web site with hyperlinking to sponsor website Large size Middle size Small size
Priority allocation of exhibition space First Second Third
Logo exposure in front of presentation rooms Large size Middle size Small size
Logo exposure in the conference registration area Large size Middle size Small size
Application to additonal oppotunities for sponsorship package Yes Yes Yes

Additional Opportunities for Sponsorship Package

Items Benefit Price Availability
A1 Conference Bags Company logo printed on tab of bags provided to each participant JPY 1,000,000 0 of 1
A2 Notepads Company name printed on notepads provided to each participant JPY 250,000 0 of 1
A3 USB memory devices with abstracts Company logo printed on USB memory devices provided to each participant JPY 500,000 0 of 1
A4 Name badges and lanyards Company logo printed on lanyards provided to each participant JPY 250,000 0 of 1
A5 Pens Company name printed on pens provided to each participant JPY 250,000 0 of 1
A6 6 days Free Pass for Kyoto City Subway Company logos printed on pass provided to each participant JPY 250,000 4 of 4
A7 Sake Masu Cups made by wood for Banquet opening event Company logo printed at side of cups provided to each Banquet attendees JPY 250,000 0 of 1

note : Only sponsors appling to sponsorship package can apply additional oppotunities for sponsorship package.

Other Sponsorship Opportunities

Items Benefit Price Maximum number of application
O1 Industrial session support Company logos displayed in the catering area during the session JPY 150,000 no limitation
O2 Support of desserts at each conference lunch (all day) Company logos displayed in the desserts area during each conference lunch JPY 150,000 no limitation
O3 Confectionery for each coffee break (all day) Company logos displayed in confectionery area during each coffee break JPY 150,000 no limitation
O4 Banquet support Company logos displayed at the Banquet site JPY 150,000 no limitation

note : Other sponsorship oppotunities can be applied regardless of sponsorship package application.

Notification for additional oppotunities and Other sponsorship : All items from A1 to A7 and from O1 to O4 are limited to two items per sponsor.