A technical exhibition will be held during the conference. Companies that provide materials, devices, equipment and services for testing, characterization, production and development of SiC and wide-bandgap materials are encouraged to exhibit at the conference.
Number of booths: 60 The application has reached the limit, but we may add extra exhibition booths with some restrictions. Please contact to email@example.com for further details. (June 1, 2019)
Exhibition fee: JPY 400,000 per 1 booth
* The fee includes regular registration for one (1) person (including welcome reception and banquet).
Application deadline: 30 June, 2019
For application and further details, please contact to:
Hirokuni Asamizu / Taketoshi Tanaka, ICSCRM2019 executive committee
Satsuki Haruhana / Rina Kano, KNT-CT Global Travel CO., LTD.