A series of International Conference on Silicon Carbide and Related Materials (ICSCRM) started in Washington D.C. in 1987. This ICSCRM2019 is the 18th conference of the ICSCRM series and the fifth ICSCRM held in Japan. The past ICSCRM series have been successfully held, owing to a great deal of financial support from the industry having activities in this technical field. The conference organizers would like to thank them for the past support, and also ask continuous one for this ICSCRM2019.
For the ICSCRM2019, we reform the supporting style to “Sponsorship packages & Other sponsorship opportunities”, so that each supporting company's commitment to the wide bandgap material and power electronics community will become more visible, which indicates each supporting company is well involved in holding ICSCRM2019. We would much appreciate your kind cooperation.
Sponsors applying to sponsorship package until the deadline of the first stage can benefit from the priority allocation of exhibition space. Because the application for exhibition booth has reached the limit, this priority service has been closed. We apologize for the inconvenience. (01 June, 2019)
For application and further details, please contact: firstname.lastname@example.org
|JPY 1,000,000||JPY 500,000||JPY 300,000|
|Advertisement in the program book||1 page color||1 page color||1/2 page gray scale|
|Logo exposure in the program book||Large size||Middle size||Small size|
|Logo exposure of conference web site with hyperlinking to sponsor website||Large size||Middle size||Small size|
|Logo exposure in front of presentation rooms||Large size||Middle size||Small size|
|Logo exposure in the conference registration area||Large size||Middle size||Small size|*Because the application for exhibition booth has reached the limit, this priority is given only to the sponsors applied before 01 June, 2019.
|Items||Benefit||Price||Availability|note : Only sponsors applying to sponsorship package can apply additional oppotunities for sponsorship package.
|Items||Benefit||Price||Maximum number of application|
|O1||Industrial session support||Company logos displayed in the catering area during the session||JPY 150,000||no limitation|
|O2||Support of desserts at each conference lunch (all day)||Company logos displayed in the desserts area during each conference lunch||JPY 150,000||no limitation|
|O3||Confectionery for each coffee break (all day)||Company logos displayed in confectionery area during each coffee break||JPY 150,000||no limitation|
|O4||Banquet support||Company logos displayed at the Banquet site||JPY 150,000||no limitation|
note : Other sponsorship oppotunities can be applied regardless of sponsorship package application.
Notification for additional oppotunities and Other sponsorship : All items from A1 to A7 and from O1 to O4 are limited to two items per sponsor.